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Reballing

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Martin’s Mini Ovens were developed originally to provide a fast and easy BGA reballing solution for rework, device failure analysis and forensics. Perfect for legacy repairs and support where components can no longer be sourced. They also offer a solution for component conversion (Sn/Pb to lead-free or lead-free to leaded). Now also available for QFN pre-bumping; a solution for reworking QFN devices which allows the user to precisely print the right amount of solder paste on the QFN, then reflow the device so that it has solder bumps of the same height and can then be reworked similar to a BGA, using only flux.