Description

Alloy: Sn96.5Ag3Cu0.5
Liquid: 217 °C

Quantity: 50.000 Pcs/Tub
Tolerance: ± 10 µm

Purity: 99.9%

Packaging: plastic box, Argon gas (Ar+)

Best before: 6 month (sealed)
Solder Spheres for reballing of CSP and BGA

Sphere Size 300µm