Martin’s Mini Oven 05 provides a fast and easy BGA reballing solution for rework, device failure analysis and forensics.

An extensive selection of stock frames and masks for BGA reballing with custom stencil designs also available.

Finding QFN devices difficult to rework – try our QFN pre-bumping solution which allows you to precisely print the right amount of solder paste on the QFN, then reflow the device so that it can be reworked similar to a BGA, with flux only.


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