Description
Alloy: Sn63Pb37
Liquid: 183 °C
Quantity: 50.000 Pcs/Tub
Tolerance: ± 10 µm
Purity: 99,9%
Packaging: plastic box, Argon gas (Ar+)
Best before: 6 month (sealed)
Solder Spheres for reballing of CSP and BGA
Sphere Size 300µm
Alloy: Sn63Pb37
Liquid: 183 °C
Quantity: 50.000 Pcs/Tub
Tolerance: ± 10 µm
Purity: 99,9%
Packaging: plastic box, Argon gas (Ar+)
Best before: 6 month (sealed)
Solder Spheres for reballing of CSP and BGA
Sphere Size 300µm