Description

High quality Tin-Lead solder spheres for reballing of CSP and BGA devices.

MARTIN Tin-Lead Solder Balls use the Sn63/Pb37 alloy and can be used for legacy products, for conversion of lead-free devices to Tin-Lead, and for exemption industries such Aerospace & Defense.

Can be used in conjunction with the Mini Oven 05 for simple, easy BGA reballing or with any other BGA reballing system.

Alloy: Sn63Pb37
Liquid: 183 °C

Quantity: 50.000 Pcs/Tub
Tolerance: ± 10 µm

Purity: 99,9%

Packaging: plastic box, Argon gas (Ar+)

Best before: 6 month (sealed)

Solder Spheres for reballing of CSP and BGA

Sphere Size 300µm