Description
High quality Lead-Free solder spheres for reballing of CSP and BGA devices.
MARTIN Lead-free Solder Balls use a SAC305 alloy – Sn96.5Ag3Cu0.5 which compliments existing alloys used SMT Electronics
Can be used in conjunction with the Mini Oven 05 for simple, easy BGA reballing or with any other BGA reballing system.
Alloy: Sn96.5Ag3Cu0.5
Liquid: 217 °C
Quantity: 50.000 Pcs/Tub
Tolerance: ± 10 µm
Purity: 99.9%
Packaging: plastic box, Argon gas (Ar+)
Best before: 6 month (sealed)
Solder Spheres for reballing of CSP and BGA
Sphere Size 250µm