Under BGA Optical Inspection

Inspectis side-view optical BGA inspection systems

Side-view BGA Inspection Systems from Inspectis, featuring the smallest, yet most robust optical probe with built-in high power lighting and a 90-degree viewing angle. The Inspectis BGA system produces high-resolution images of otherwise hidden solder joints beneath BGAs, μBGAs, CSP, CGA and FlipChip packages with as low as 40 microns standoff. Can be used for discovering micro-cracks, cold solder joints, whiskers, missing balls, scaling, excess flux and other soldering issues in SMT/BGA assembly.

Variable focus optics allows the user to view images of a single solder ball and up to 20 rows of BGA solder bumps. An electronically dimmable high-power LED fiber brush light for background illumination provides stunning images, allowing the user to quickly inspect along the edges and to focus down the rows. The unique soft-touch mechanism design of the stand bracket protects the micro-prisms in the optical probe tip from damage when positioned on the surface of the PCB under inspection.

The INSPECTIS BGA Inspection Systems feature a 5.0 megapixel USB3.0 digital microscope combined with a stand and INSPECTIS BGA Inspection Software. A 180-degree pivoting mechanism facilitates easy alignment of the probe along 3 different sides of the BGA package.

The BGA Inspection system is available in 2 system levels, Basics and ProX, both including powerful INSPECTIS BGA Inspection, analysis and documentation software.

The Inspectis ProX BGA Inspection System includes an integrated micro-prism background light mounted on a compact, robust stand with an XY-translation stage and ProX INSPECTIS BGA Inspection, analysis and documentation software.