Description

High quality Lead-Free solder spheres for reballing of CSP and BGA devices.

MARTIN Lead-free Solder Balls use a SAC305 alloy – Sn96.5Ag3Cu0.5 which compliments existing alloys used SMT Electronics

Can be used in conjunction with the Mini Oven 05 for simple, easy BGA reballing or with any other BGA reballing system.

Alloy: Sn96.5Ag3Cu0.5
Liquid: 217 °C

Quantity: 50.000 Pcs/Tub
Tolerance: ± 10 µm

Purity: 99.9%

Packaging: plastic box, Argon gas (Ar+)

Best before: 6 month (sealed)
Solder Spheres for reballing of CSP and BGA