
Why do I need to Bake Devices
Baking Removes Moisture in Devices Safely Why do I need to bake devices once the component floor life is exceeded? Simply put moisture absorbed in MSD’s (Moisture Sensitive Devices) when thermally processed through an SMT Reflow Oven will boil, turn to steam and cause high internal pressures that can cause popcorning, cracking & delamination of […]

