Reballing Solder Balls for BGA, CSP and Flip-Chip Devices

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Quick, easy BGA reballing solution for rework, repair, device failure analysis, forensics and legacy repairs where obsolete components can no longer be sourced.

Mini Oven 05 BGA Reballing

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BGA Reball 04 Set Standard

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QFN Prebump Set

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Solder Spheres Sn63Pb37 250µm
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Solder Spheres Sn63Pb37 300µm
£146.00 Add to basket

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Solder Spheres Sn63Pb37 400µm
£146.00 Add to basket

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Solder Spheres Sn63Pb37 450µm
£198.00 Add to basket

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Solder Spheres Sn63Pb37 500µm
£146.00 Add to basket

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Solder Spheres Sn63Pb37 600µm
£146.00 Add to basket

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Solder Spheres Sn63Pb37 762µm
£206.00 Add to basket

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Solder Spheres Sn96.5Ag3Cu0.5 250µm
£198.00 Add to basket

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Solder Spheres Sn96.5Ag3Cu0.5 300µm
£146.00 Add to basket

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Solder Spheres Sn96.5Ag3Cu0.5 350µm
£252.00 Add to basket

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Solder Spheres Sn96.5Ag3Cu0.5 400µm
£146.00 Add to basket

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Solder Spheres Sn96.5Ag3Cu0.5 450µm
£186.00 Add to basket

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Solder Spheres Sn96.5Ag3Cu0.5 500µm
£152.00 Add to basket

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Solder Spheres Sn96.5Ag3Cu0.5 600µm
£146.00 Add to basket

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Solder Spheres Sn96.5Ag3Cu0.5 762µm
£206.00 Add to basket

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t: 01494 439786

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Reballing

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Categories

Product categories

Mini Oven 05 BGA Reballing

BGA Reball 04 Set Standard

QFN Prebump Set

Solder Spheres Sn63Pb37 250µm

Solder Spheres Sn63Pb37 300µm

Solder Spheres Sn63Pb37 400µm

Solder Spheres Sn63Pb37 450µm

Solder Spheres Sn63Pb37 500µm

Solder Spheres Sn63Pb37 600µm

Solder Spheres Sn63Pb37 762µm

Solder Spheres Sn96.5Ag3Cu0.5 250µm

Solder Spheres Sn96.5Ag3Cu0.5 300µm

Solder Spheres Sn96.5Ag3Cu0.5 350µm

Solder Spheres Sn96.5Ag3Cu0.5 400µm

Solder Spheres Sn96.5Ag3Cu0.5 450µm

Solder Spheres Sn96.5Ag3Cu0.5 500µm

Solder Spheres Sn96.5Ag3Cu0.5 600µm

Solder Spheres Sn96.5Ag3Cu0.5 762µm

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