Is reflow profiling a priority in your process or is it considered a hurried task which will allow you to start production?
Is reflow profiling a production planning problem rather than a time saving saving and quality improvement tool?
Are components reworked as part of the process as there is always a short in the same area or a BGA sometimes doesn’t reflow properly?
are issues in many companies when understandably production demands or
the lack of spare boards for profiling results in very little reflow
profiling and reflow process checking.
On one side of production demands is time, reflow profiling and reflow process checking stops production and the benefits are not readily apparent.
On the other side of production demands is QA, time is wasted with inspection flagging problems resulting in rework, which uses more production time.
A lot of this could be unnecessary rework, an in spec. reflow profile created at the prototype stage and the the reflow process checked periodically ensures the process is not creating unnecessary rework.
It is difficult to introduce best practices for reflow profiling into the prototyping and production planning as this all impacts on yield and the need for spare boards to use for reflow profiling and relow process checks.
Reflow profiling becoming a frustrating requirement which uses time
needed for production when it could be an easy task which saves
production time, when the right tools are used, it is possible to create the best reflow profile for your process and to aid production planning with little time spent creating and perfecting the reflow profile, reflow process checks can be done without stopping production or even without a spare board!
KICs reflow profilers supplied with verification software creating the best starting profile before a board has been put through the oven and optimisation software which improves the first profile, quickly creates an in spec. reflow profile at the start.
The KIC MVP (Manual Virtual Profiling) Fixture can be used to check the reflow process during production without the need for a board, once the MVP has initially been send through the oven with a board the thermal characteristics of the board are stored which are used when putting the MVP through the reflow oven to perform reflow process checks later.
Taken one stage further installing the KIC RPI a 24 hour monitoring and reflow profile traceability system into the reflow oven and you have all the advantages, quick reflow profile setup and optimisation with the reflow process being checked and stored for every board.
All of KIC’s software uses the PWI system, a single number score which identifies that the reflow profile is within spec. this avoids checking all the different results, saving more time.
KICs reflow profiling software is easy to use, so once configured by an engineer reflow profiling and reflow profile checks can be performed with very little training.
This addresses all of the usual reasons that normally stop the creation of an in spec. reflow profile at the start of production, optimising the profile further and why reflow process checks are not performed.
So will introducing a best practices for reflow profile management impact on production planning time, well the answer is yes, it should reduce unnecessary rework, increase quality and reliability of the solder joints, this all saves production time and reduces waste.
KICs software can also be used to optimise the reflow profile to reduce product change over times or save power, this is all done whilst keeping the reflow profile in spec.