The APP Print Tool allows the user to print solder paste directly on to the component pads for QFN and CSP devices.
The tool can then be placed, solder paste down, in the holder.
The holding arm is then rotated backwards to allow for the device to be picked directly with the AVP4.1 arm.
This insures that the solder paste on the component is never touched by hand and provides consistent paste volumes for rework.
Suitable for use with: