The Dipp APP tool allows fluxing of BGA devices by dip method, immediately before rework placement.
Supplied with a squeegee which is used to dispense the flux onto the flux Dipp tray.
The component is then dipped into the flux using the AVP arm and then placed with the correct amount of flux for soldering.
A range of sizes and dip depths are available.
Depth 0.08mm, 0.15mm & 0.22mm
Supplied with with squeegee
Suitable for use with: